In general, maintenance signatures are given for those applications that were tested in the last year and a half. Maintenance signatures are meant for correcting MINOR or COSMETIC issues that DO NOT require introduction of new components.
Important:
Neither PTEC nor RiDP test your maintenance signatures. It is your organization's responsibility to fully test your maintenance signature solutions before releasing maintenance builds/signatures to third parties.
- Open a new incident and request a maintenance signature. Be prepared to upload an unsigned build of your application. The application zip file needs to follow the normal rules for submission:
For SDK/J
- SDK/J Application as a zip fileThat includes:Dalp file following specification, main jar and option jars
- For Dalp SDK/J Specification refer to documentation: sdkj_xlet_develop_xlet_eRxxx.pdf
For Android
- Android Application as a zip file that includes: Dalp file following specification and Android apk file.
- For Dalp SmartSDK Specification refer to documentation: /doc/en/start_ml/120-03-0100.htm?null
- To ensure your build complies with standards. Use the ssdkpkg_checker.exe tool. Documentation and object(tool) are on developer resource CD: yourDeveloperCDlocation\obj\tool\ssdkpkg_checker
- Provide an official document/text file that documents your release notes for the maintenance signature. These are the details in regards to your fix. (description, code snippet, etc)
Example: This build corrects issues related to xxxx. The components that include the new changes are (list your code components)
- Please CREATE a new version number within your dalp file as this will allow to differentiate between certification signature and the new maintenance signature.
- Some best practices are:
x.y.z kind of version
x - major release
y - minor release
z - build number
Example: if certified version was 7.0.1.2 new version build should change. either 7.1.0.0 or 7.0.1.3 (use your own versioning, main point is to be able to differentiate builds)
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